MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202517079058 A) filed by Tactotek Oy, Oulunsalo, Finland, on Aug. 20, for 'interface assembly and method for manufacturing interface assembly.'
Inventor(s) include Keranen, Antti; Heikkinen, Mikko; Hanninen, Ilpo; Apilo, Palvi; Saaski, Jarmo; Simula, Tomi; Braysy, Vinski; Wuori, Topi; and Korhonen, Pasi.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "An interface assembly (100 is disclosed herein which comprises a functional multilayer structure (20) that comprise a first substrate (22, 28), a molded material layer (26) on a first side of the first substrate (22, 28), and a sensor arrangement (30) comprising at least one sensor (32; 32A, 32B), wherein the sensor arrangement (30) is arranged at least partly embedded into the molded material layer (26). The assembly (100) further comprises a movable member (40) being movable relative to the functional multilayer structure (20), wherein the movable member (40) comprises at least one detection portion (42), and the sensor arrangement (30) and the at least one detection portion (42) are mutually arranged so that a position or a change of position of the movable member (40) is detectable by the sensor arrangement (30) based on a position or a change of position of the at least one detection portion (42) relative to the sensor arrangement (30). Also, a method for manufacturing an interface assembly (100) is disclosed."
The patent application was internationally filed on Jan. 29, 2024, under International application No.PCT/FI2024/050035.
Disclaimer: Curated by HT Syndication.
