MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202547098475 A) filed by Towa Corporation, Kyoto, Japan, on Oct. 13, for 'laser processing device, and method for manufacturing laser-processed article.'
Inventor(s) include Mogami, Takuya; Okawa, Hiroki; and Mihara, Takayuki.
The application for the patent was published on Nov. 14, under issue no. 46/2025.
According to the abstract released by the Intellectual Property India: "Provided is a laser processing device capable of performing laser processing while efficiently sucking up dust. This laser processing device comprises: a stage (60); an outer peripheral wall section (30) that is arranged such that a hollow space (S) extends from a position near the stage (60) to a position distant from the stage (60); a cylindrical wall section (20) that divides the hollow space (S) into an inner space (S1) and an outer space (S2); an irradiation unit (40) that emits a laser beam (L) such that the laser beam passes through the inner space (S1) and irradiates a workpiece (W); a transparent member (50) that is provided so as to close the inner space (S1); and a lid member (10) that has a first opening (11) and is arranged between the cylindrical wall section (20) and the outer peripheral wall section (30) so as to close the outer space (S2). The cylindrical wall section (20) has a second opening (22) at a position that is nearer to the stage (60) than the transparent member (50) is to the stage (60)."
The patent application was internationally filed on Dec. 05, 2023, under International application No.PCT/JP2023/043452.
Disclaimer: Curated by HT Syndication.
