MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517040657 A) filed by Besi Netherlands B. V., Duiven, Netherlands, on April 28, for 'lead forming device for forming an electronic component lead and a method for forming an electronic component lead.'
Inventor(s) include Schoenaker, Robertus Christina Johannes Maria.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "The invention relates to a lead forming device for forming an electronic component lead, comprising: two cooperating opposite tool parts relatively movable towards and away from each other; a first clamp half attached to one of the tool parts and a second clamp half attached to the opposite tool part for clamping at least part of the lead. The invention also relates to a method for forming an electronic component lead, comprising the following steps: a) providing an electronic component comprising at least one lead; b) clamping the at least one lead on opposite sides of the lead at a clamping location adjacent to the electronic component and away from a tip of the lead; and c) bending the lead in a first bending direction at a first bending location."
The patent application was internationally filed on Sept. 26, 2023, under International application No.PCT/NL2023/050502.
Disclaimer: Curated by HT Syndication.
