MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202517045100 A) filed by Seoul Viosys Co. Ltd., Gyeonggi, Republic of Korea, on May 9, for 'light emitting diode package.'
Inventor(s) include Min Seung Gu; and Lee Young Jin.
The application for the patent was published on May 30, under issue no. 22/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to a light emitting diode package. According to one aspect of the present invention provided is a light emitting diode package comprising: a package substrate including a first substrate electrode and a second substrate electrode that are spaced apart from each other; a light emitting diode chip arranged on the package substrate so that the first substrate electrode and the second substrate electrode are electrically connected; and an encapsulant which includes a fluorine compound and which covers the light emitting diode chip such that at least a part thereof is in contact with the light emitting diode chip."
The patent application was internationally filed on Oct. 19, 2023, under International application No.PCT/KR2023/016281.
Disclaimer: Curated by HT Syndication.
