MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517060257 A) filed by Shenzhen Shokz Co. Ltd., Guangdong, China, on June 24, for 'loudspeaker assembly and earphone.'
Inventor(s) include Zhu, Guangyuan; Zhang, Lei; and Qi, Xin.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "Disclosed in the present application are a loudspeaker assembly and an earphone. The earphone comprises a housing assembly, a bone conduction mechanism module and an air conduction mechanism module, wherein the housing assembly is provided with an accommodating space; the bone conduction mechanism module is arranged in the accommodating space and generates vibration in a first vibration direction; and the air conduction mechanism module is arranged in the accommodating space, the air conduction mechanism module and the bone conduction mechanism module being arranged in the first vibration direction and facing each other. By means of the described configuration, the present application can reduce the impact of the air conduction mechanism module on the vibration effect of the bone conduction mechanism module, thus improving the sound volume and enhancing the bone conduction effect of the loudspeaker assembly, and thereby improving the sound quality of the loudspeaker assembly."
The patent application was internationally filed on Oct. 23, 2023, under International application No.PCT/CN2023/126027.
Disclaimer: Curated by HT Syndication.
