Intellectual Property India Publishes Patent Application for 'Manufacture Of Surface Relief Structures' Filed by Snap, Inc.

MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202518095892 A) filed by Snap, Inc., Santa Monica, U.S.A., on Oct. 6, for 'manufacture of surface relief structures.'

Inventor(s) include Sturland, Ian; Venables, Mark; Hawke, Tracey; Mills, Rory; and Macken, Ian.

The application for the patent was published on Nov. 14, under issue no. 46/2025.

According to the abstract released by the Intellectual Property India: "The present invention relates to a method and apparatus for the etching of variable depth features in a substrate is described. Movement of the substrate relative to an etchant (e.g. into or out of the etchant) during the etching process is utilised to provide a varying etch time, and hence depth, across the substrate, and in various examples this is enabled without requiring a varying mask."

The patent application was internationally filed on Aug. 20, 2020, under International application No.PCT/GB2020/051997.

Disclaimer: Curated by HT Syndication.