MUMBAI, India, July 11 -- Intellectual Property India has published a patent application (202521059498 A) filed by Dr. Sharad Kisan Nirgude; Dr. Shyamkumar Devidas Kalpande; Mr. Sandip Namdev Pawar; and Miss. Neha Sanjay Gaikwad, Nashik, Maharashtra, on June 20, for 'manufacturing of test rig for bus bar clamping force measurement.'
Inventor(s) include Dr. Sharad Kisan Nirgude; Dr. Shyamkumar Devidas Kalpande; Mr. Sandip Namdev Pawar; and Miss. Neha Sanjay Gaikwad.
The application for the patent was published on July 11, under issue no. 28/2025.
According to the abstract released by the Intellectual Property India: "This paper presents a test rig designed for the precise measurement and optimization of clamping forces applied to hybrid aluminum-copper bus bars, ensuring optimal electrical and mechanical performance. The test rig is crucial for reducing contact resistance at the joint, thereby enhancing conductivity and minimizing heat generation, which is vital for preventing thermal runaway and potential failures in electrical connections. Additionally, the rig enables the assessment of material compatibility, evaluating how different clamping forces affect aluminum-copper interfaces to optimize joint performance. Long-term durability and reliability testing, including mechanical and thermal cycling, are incorporated to assess the joint's resilience under diverse operational conditions. The rig is especially valuable in the automotive and electric vehicle (EV) industries, where it evaluates the performance of joints in electric vehicle power distribution networks. Furthermore, it supports research and development efforts aimed at understanding the mechanical and electrical behavior of aluminum-copper joints under various clamping forces, contributing to the advancement of joint technology for high-performance electrical applications."
Disclaimer: Curated by HT Syndication.
