MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517058522 A) filed by Dai Nippon Printing Co. Ltd., Tokyo, on June 18, for 'metal terminal adhesive film, production method therefor, metal terminal equipped with metal terminal adhesive film, power storage device external packaging material, kit comprising power storage device external packaging material and metal terminal adhesive film, power storage device, and production method therefor.'
Inventor(s) include Katou, Takahiro; Fujiwara, Ryo; Kodani, Kazufumi; Satake, Mizuki; and Mizoshiri, Makoto.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "A metal terminal adhesive film for interposition between a metal terminal that is electrically connected to an electrode of a power storage device element and a power storage device external packaging material that seals the power storage device element, said metal terminal adhesive film being composed of a laminate having at least a first layer that is positioned on the side toward the power storage device external packaging material, a colored layer, and a second layer positioned on the side toward the metal terminal, in the given order, wherein the thickness of the colored layer is 50 m or less."
The patent application was internationally filed on Nov. 27, 2023, under International application No.PCT/JP2023/042421.
Disclaimer: Curated by HT Syndication.
