Intellectual Property India Publishes Patent Application for 'Method, Mould, And Housing For Forming An Electronic Component Package' Filed by Besi Netherlands B. V.

MUMBAI, India, June 6 -- Intellectual Property India has published a patent application (202517046012 A) filed by Besi Netherlands B. V., Duiven, Netherlands, on May 13, for 'method, mould, and housing for forming an electronic component package.'

Inventor(s) include Gal, Wilhelmus Gerardus Joseph; and Kersjes, Sebastianus Hubertus Maria.

The application for the patent was published on June 6, under issue no. 23/2025.

According to the abstract released by the Intellectual Property India: "The present invention relates to a method for forming an electronic component package, comprising steps of: providing and placing a housing on the carrier whereon the electronic component is mounted, as such that the electronic component is located in an opening of the housing, and introducing a moulding material surrounding the housing to provide a moulded electronic component package. The invention also relates to a housing with at least one enclosed opening for holding an electronic component and the use of such a housing in that method, as well as to the resulting moulded electronic component package."

The patent application was internationally filed on Oct. 06, 2023, under International application No.PCT/NL2023/050523.

Disclaimer: Curated by HT Syndication.