MUMBAI, India, June 6 -- Intellectual Property India has published a patent application (202517023772 A) filed by Tokarev, Vladimir Nikolaevich, Kraskovo, Russia, on March 18, for 'method and device for processing brittle transparent and semi-transparent materials.'
Inventor(s) include Tokarev, Vladimir Nikolaevich.
The application for the patent was published on June 6, under issue no. 23/2025.
According to the abstract released by the Intellectual Property India: "The proposed invention relates to a method and device for the controlled separation (cutting) of hard transparent and semi-transparent brittle materials, including tempered and superhard materials, using a process of laser filamentation separation (LFS), and can be used in the manufacture of smartphones, tablets and wearable electronics, as well as in automobile manufacturing, building, and instrumentation manufacturing. The present method includes quantitatively determining the radiation parameters fully governing an LFS process. Also proposed is a laser device in which the radiation parameters for a cutting procedure are set according to the values determined using the aforesaid method, taking into account the properties of the material selected for LFS. The technical result is that of achieving smoother side walls during separation, increasing the energy efficiency of LFS, and achieving high-speed LFS or making it possible to perform LFS using a laser beam with a very low average laser power (in the order of tenths of a watt) while still achieving a considerable separation speed that is acceptable for use."
The patent application was internationally filed on Aug. 18, 2023, under International application No.PCT/RU2023/050191.
Disclaimer: Curated by HT Syndication.
