MUMBAI, India, June 20 -- Intellectual Property India has published a patent application (202414092853 A) filed by Pontis Emc Gmbh, Schwarzenfeld, Germany, on Nov. 27, 2024, for 'method for ensuring the electrical shielding of a device housing.'
Inventor(s) include Bohm, Erich.
The application for the patent was published on June 20, under issue no. 25/2025.
According to the abstract released by the Intellectual Property India: "The invention relates to a method for ensuring the electrical shielding of a device housing (10) during 5 processing, which device housing (10) comprises a hollow profile (12) that is closed on the front side by a housing cover (14), both the hollow profile and the housing cover being electrically conductive, which housing cover (14) comprises an annular extension (16) that encompasses a thinned section (18) at the end of the hollow profile (12), 10 wherein the height (h) of the annular extension (16) is less than the height (H) of the thinned section (18), so that the front side of the thinned section (18) contacts the cover interior, and a distance (a) remains between the free end of the annular extension (16) and a ledge (20) at the beginning of the thinned section (18), wherein a processing cover (30) is used for processing the device housing (10) and also comprises a annular extension (32), wherein the height (h2) of the annular extension (32) of 15 the processing cover (30) is greater than the height (H) of the thinned section (18) so that, during painting, said extension adjoins the ledge (20) at the beginning of the thinned section (18) of the hollow profile (12)."
Disclaimer: Curated by HT Syndication.
