MUMBAI, India, Sept. 5 -- Intellectual Property India has published a patent application (202441011605 A) filed by Arpula Suri Babu; and Arpula Vasavi, Secunderabad, Telangana, on Feb. 20, 2024, for 'method for manufacturing medium density fiberboard (mdf) and high density fiberboard (hdf) using green raw material.'
Inventor(s) include Arpula Suri Babu; and Arpula Vasavi.
The application for the patent was published on Sept. 5, under issue no. 36/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to method of manufacturing MDF and HDF boards using green raw materials that include de-oiled bran, micro silica produced from rice husk ash and phenol formaldehyde as binding material in which the de-oiled bran and micro silica in the ratio of 75:25 (75% de-oiled bran and 25% micro silica) in feed in mixing chamber where at first wax is injected which is distributed evenly by the turbulent movement of the fiber to coats the fiber, then a resin (phenol-formaldehyde) is then injected as a main binding material and mixes well mixture is fed continuously to hydraulic press by applying high temperature and pressure to get medium density and high density boards. This hydraulic pressed material is simultaneously cut into the required sizes in a cutting machine."
Disclaimer: Curated by HT Syndication.
