MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202537095453 A) filed by Towa Corporation, Kyoto, Japan, on Oct. 4, for 'method for producing resin molded article, molding mold and resin molding apparatus.'
Inventor(s) include Yoshida Yusuke; Onishi Yohei; Sunada Mamoru; and Morikami Atsushi.
The application for the patent was published on Nov. 14, under issue no. 46/2025.
According to the abstract released by the Intellectual Property India: "Provided is a method for producing a resin molded article, the method suppressing the occurrence of wrinkles in a mold release film during compression molding using the mold release film, and also suppressing the formation of resin projections that may drop during conveyance of the resin molded article after resin molding. In the method for producing a resin molded article according to the present disclosure: in a resin molding step, a molding object is disposed between an upper mold and a lower mold (200), a mold release film is disposed on the bottom surface and the side surface of a cavity (200A), and a resin molded article is produced by performing resin molding by means of compression molding, in which a molding mold is clamped, with a resin material being disposed on the mold release film; and in a conveyance step, the molding mold is opened after the resin molding step, and the resin molded article is taken out from the molding mold and conveyed. At the upper surface of a lower-mold side surface member (201), a depth difference (201D) that is equal to or less than the thickness of the mold release film is formed in a position at which the upper surface is adjacent to the inner peripheral surface of the lower-mold side surface member (201)."
The patent application was internationally filed on Oct. 30, 2023, under International application No.PCT/JP2023/039034.
Disclaimer: Curated by HT Syndication.
