Intellectual Property India Publishes Patent Application for 'Method For Use In Call, Device, Chip System, And Storage Medium' Filed by Honor Device Co. Ltd.

MUMBAI, India, Nov. 7 -- Intellectual Property India has published a patent application (202537103688 A) filed by Honor Device Co. Ltd., Guangdong, China, on Oct. 28, for 'method for use in call, device, chip system, and storage medium.'

Inventor(s) include Li, Haibo.

The application for the patent was published on Nov. 7, under issue no. 45/2025.

According to the abstract released by the Intellectual Property India: "The present application provides a method for use in a call, a device, a chip system, and a storage medium. The method is applied to a terminal device. First information in a first RRC reconfiguration message currently received from a first cell, and a first parameter and a value corresponding to the first parameter in a locally stored first configuration item are verified, and an abnormal value corresponding to the first parameter is ignored when the value corresponding to the first parameter is abnormal, so that the first RRC reconfiguration message is successfully verified, thereby ensuring that the terminal device can complete RRC reconfiguration, and reducing the probability of RRC reconfiguration failure."

The patent application was internationally filed on Nov. 17, 2023, under International application No.PCT/CN2023/132198.

Disclaimer: Curated by HT Syndication.