MUMBAI, India, June 6 -- Intellectual Property India has published a patent application (202518048252 A) filed by Interdigital Patent Holdings, Inc., Wilmington, U.S.A., on May 19, for 'methods for multi-sim ue connected mode operation.'

Inventor(s) include Adjakple, Pascal; Murray, Joseph; Starsinic, Michael; Di Girolamo, Rocco; Chen, Zhuo; and Ly, Quang.

The application for the patent was published on June 6, under issue no. 23/2025.

According to the abstract released by the Intellectual Property India: "Methods and apparatuses are described herein for multi-subscriber identification module (SIM) connected mode operation. In one embodiment, a wireless communications device may receive, from an access stratum interface, a request access to the receiver chain during a receiving opportunity. The wireless communications device may determine that the receiver chain is available during the receiving opportunity. The wireless communications device may send a response indicating access is granted to cause the access stratum interface to receive a downlink transmission during the receiving opportunity. The wireless communications device may receive, from the access stratum interface, a second request for a transmitter chain during a transmitting opportunity. The wireless communications device may determine that the transmitter chain is available during the transmitting opportunity. The wireless communications device may send a second response indicating access is granted to enable the access stratum interface to transmit an uplink transmission during the transmitting opportunity."

The patent application was internationally filed on Nov. 13, 2020, under International application No.PCT/US2020/060444.

Disclaimer: Curated by HT Syndication.