MUMBAI, India, Aug. 1 -- Intellectual Property India has published a patent application (202517049747 A) filed by Corning Incorporated, Corning, U.S.A., on May 23, for 'modular metal flow reactors with metal structures enabling reconfigurable process fluid flow, high thermal stability, and high working pressure.'
Inventor(s) include Gremetz, Sylvain Maxime F.
The application for the patent was published on Aug. 1, under issue no. 31/2025.
According to the abstract released by the Intellectual Property India: "A flow reactor comprises a frame, fluidic modules supported by the frame, metal plates between which the fluidic modules are arranged one by one in a first direction, metal inserts, and tightening members extending in the first direction through the metal plates and the fluidic modules. Each fluidic module comprise a metal reaction layer with opposed major outer surfaces, a fluid passage disposed therein, and module ports that extend between the major outer surfaces. The module ports comprise intersecting ports that intersect the fluid passage. Each metal plate has plate ports corresponding to the module ports. Each metal insert abuts a corresponding pair of ports adjacently spaced in the first direction such that every intersecting port is abutted by at least one metal insert. The tightening members compress the two metal plates and the fluidic modules against the metal inserts."
The patent application was internationally filed on Nov. 15, 2023, under International application No.PCT/US2023/079814.
Disclaimer: Curated by HT Syndication.
