MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202411025538 A) filed by Chandigarh Group Of Colleges, Mohali, Punjab, on March 28, 2024, for 'modular package opener.'
Inventor(s) include Dr. Parveen Singla; Dr. Dinesh Arora; Dr. Ruchi Singla; Ritwika Raj; Nandita; and Onkar.
The application for the patent was published on Nov. 14, under issue no. 46/2025.
According to the abstract released by the Intellectual Property India: "A modular package opener comprises of a wearable body 1 having a hemisphere topped by a cylindrical member, a touch sensor installed in the body 1 for detecting the user's fingers in the body 1, an artificial intelligence-based imaging unit 2 installed on the body 1 to determine pattern of an adhesive tape wrapped on a packed carton, a speaker 5 installed in the body 1 to produce audio signals for guiding the user to position the worn body 1 in proximity to the carton, a laser projection unit 7 is installed in the body 1 for projecting laser beams on the carton in view of guiding the user to move the body 1 over the projected beams and a blade 4 installed on the body 1 by means of a motorized hinge joint 3 to provide converging or diverging movement to the blade 4."
Disclaimer: Curated by HT Syndication.
