MUMBAI, India, March 13 -- Intellectual Property India has published a patent application (202611007553 A) filed by Chandigarh University, Mohali, Punjab, on Jan. 27, for 'multifunctional polymer nanocomposite incorporating synergistic fillers for enhanced thermal, barrier, and antimicrobial performance.'
Inventor(s) include Devyanshu Sachdev; Suhail Khan; Salil Batabyal; Saroj Rani; Dr. Rhydum Sharma; and Rishu Kumar.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "The present invention introduces a multifunctional polymer nanocomposite comprising a hybrid polymeric matrix of poly(n-vinylpyrrolidone) and polyaniline reinforced with synergistic fillers uniformly dispersed within the matrix. The incorporation of fillers results in a compact nanostructure with strong polymer-filler interfacial interactions, leading to enhanced thermal stability, increased onset degradation temperature, and a significant reduction in water vapour transmission rate due to the formation of tortuous diffusion pathways. The fillers further restrict the polymer chain mobility, improving structural integrity and durability. In addition to thermal and barrier enhancements, the nanocomposite exhibits elevated antibacterial resistance, attributed to the combined effect of the conducting PANI matrix and filler-induced surface interactions that inhibit microbial adhesion and disrupt bacterial cell membranes. It also provides a method for preparing the nanocomposite through in-situ polymerisation and coating compositions suitable for heat resistant, moisture barrier and antimicrobial protective applications."
Disclaimer: Curated by HT Syndication.
