MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517057852 A) filed by Murata Manufacturing Co. Ltd., Kyoto, Japan, on June 16, for 'multilayer ceramic electronic component.'
Inventor(s) include Mishima Yasuhiro.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "Provided is a layered ceramic electronic component 1 with which migration of Ag included in a resin electrode can be suppressed, and thus the occurrence of short-circuits between electrodes can be suppressed. In the layered ceramic electronic component 1, a first external electrode 20 extends to first and second main surface sides, and a second external electrode 21 extends to the first and second main surface sides. Between a first conductive resin layer 34 and a first main surface M1 of a layered body 2, there is a first Ni plating wraparound layer in which a first Ni plating layer 36 is disposed. Between the first conductive resin layer 34 and a second main surface M2 of the layered body 2, there is a second Ni plating wraparound layer in which the first Ni plating layer 36 is disposed. Between a second conductive resin layer 35 and the first main surface M1 of the layered body 2, there is a third Ni plating wraparound layer in which a second Ni plating layer 37 is disposed. Between the second conductive resin layer 35 and the second main surface M2 of the layered body 2, there is a fourth Ni plating wraparound layer in which the second Ni plating layer 37 is disposed."
The patent application was internationally filed on Nov. 06, 2023, under International application No.PCT/JP2023/039923.
Disclaimer: Curated by HT Syndication.
