MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202411019104 A) filed by Chairman, Defence Research & Development Organisation; and Indian Institute Of Technology Delhi, New Delhi, on March 15, 2024, for 'multilayered coated and laminated material for high altitude airships, article and methods thereof.'
Inventor(s) include Butola, Bhupendra Singh; Joshi, Mangala; Chouhan, Shikha; Tiwari, Rishabh; and Kumar, Manoj.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "The present disclosure generally relates to the field of polymer, textile, coating lamination and airship hull material. Specifically, the present disclosure relates to a multilayered coated and laminated material for high altitude airships, a method for its preparation and an article comprising the same. The laminate includes a lightweight, high-strength load-bearing layer consisting of Para-aramid, UHMWPE, and Vectran fabrics, providing excellent strength-to-weight ratio. The material of the present disclosure is specifically designed for high-altitude airship applications. The multilayered coated plus laminated material is suitable for lightweight hull materials and is flexible, improved helium gas barrier, shows excellent resistance to UV exposure and can withstand high altitudes and gas pressure."
Disclaimer: Curated by HT Syndication.
