MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202514003021 A) filed by Triple Win Technology Co. Ltd., Shenzhen, China, on Jan. 13, for 'package structure of optical emission module and preparation method.'
Inventor(s) include Hsin-Yen Hsu; and Tzu-Li Feng.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "A package structure of an optical emission module and a preparation method thereof are provided. The package structure includes a substrate module and an optical emission module. The substrate module includes a substrate, and multiple channels are defined in the substrate module. The optical emission module is located on the substrate. Two ends of each channel extend to the substrate and the optical emission module, respectively. An inner wall of each channel is provided with a conductive layer to form a hollow conductive channel. The hollow conductive channel is electrically connected to the substrate and the optical emission module."
Disclaimer: Curated by HT Syndication.
