MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202547067916 A) filed by Qualcomm Incorporated, San Diego, on July 16, for 'package substrate comprising at least two core layers.'
Inventor(s) include We, Hong Bok; Buot, Joan Rey Villarba; and Kim, Michelle Yejin.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "A package comprising a substrate and an integrated device coupled to the substrate. The substrate includes (i) a first cored substrate portion comprising a first core layer comprising a first cavity, a first integrated device located in the first cavity of the first core layer, and a first dielectric layer encapsulating the first integrated device; and (ii) a second cored substrate portion comprising a second core layer comprising a second cavity, a second integrated device located in the second cavity of the second core layer and a second dielectric layer encapsulating the second integrated device."
The patent application was internationally filed on Mar. 06, 2024, under International application No.PCT/US2024/018652.
Disclaimer: Curated by HT Syndication.
