Intellectual Property India Publishes Patent Application for 'Package Supply System' Filed by Tmt Machinery, Inc.

MUMBAI, India, June 6 -- Intellectual Property India has published a patent application (202414090620 A) filed by Tmt Machinery, Inc., Osaka, Japan, on Nov. 21, 2024, for 'package supply system.'

Inventor(s) include Yasuo Okuyama.

The application for the patent was published on June 6, under issue no. 23/2025.

According to the abstract released by the Intellectual Property India: "A package supply system includes a package hooking stand (12), a creel robot (30), and a transport device. Packages (50) are hooked onto a first surface and a second surface of the package hooking stand (12), respectively. The creel robot (30) collects the packages on the second surface of the package hooking stand (12) at a first standby position or the packages (50) on the first surface of the package hooking stand (12) at a second standby position, and transfers the packages (50) to a creel stand (61). The transport device causes the first surface of the package hooking stand (12) to face a movement route of the creel robot (30) by causing the package hooking stand (12) to be moved in the second standby position while keeping an orientation of the package hooking stand (12) after the creel robot (30) transfers the packages (50) of the package hooking stand (12) at the first standby position."

Disclaimer: Curated by HT Syndication.