MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202424062622 A) filed by Leef Blattwerk Gmbh, Potsdam, Germany, on Aug. 19, 2024, for 'packaging for an article and a packaged article.'
Inventor(s) include Claudio Fritz-Vietta.
The application for the patent was published on May 30, under issue no. 22/2025.
According to the abstract released by the Intellectual Property India: "The disclosure relates to a packaging for an article, comprising: a three-dimensionally shaped packaging bottom (1) of a leaf material of a plant, the packaging bottom (1) being adapted to receive an article to be packaged and comprising: a bottom support surface (2), a bottom side wall (3) surrounding the bottom support surface (2), and a bottom edge (4) arranged at an end of the bottom side wall (3), the end being distal with respect to the bottom support surface (2), wherein the bottom edge (4) protrudes outwardly from the bottom side wall (3); and a packing cover (5) comprising recesses (6). The packing cover (5) is arranged on the packaging bottom (1) such that outwardly projecting bottom edge portions (7) engage in respective ones of the recesses (6) of the packing cover (5) such that the packing cover (5) is fixed in its relative position with respect to the packaging bottom (1). Furthermore, a packaged article is provided."
Disclaimer: Curated by HT Syndication.
