MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202424062623 A) filed by Leef Blattwerk Gmbh, Potsdam, Germany, on Aug. 19, 2024, for 'packaging for an article and a packaged article.'
Inventor(s) include Claudio Fritz-Vietta.
The application for the patent was published on May 30, under issue no. 22/2025.
According to the abstract released by the Intellectual Property India: "The disclosure relates to a three-dimensionally shaped packing bottom (1) of a leaf material of a plant, the packing bottom (1) being adapted to receive an article to be packaged and comprising: a bottom support surface (2), a bottom side wall (3) surrounding the bottom support surface (2), and a bottom edge (4) arranged at an end of the bottom side wall (3), the end being distal with respect to the bottom support surface (2), wherein the bottom edge (4) protrudes outwardly from the bottom side wall (3); and a packaging cover (5) with inwardly protruding flaps (6). The packaging cover (5) is arranged on the packaging bottom (1) such that the flaps (6) and an inner side (7) of the packaging cover (5) at least partially encompass the bottom edge (4), so that the packaging cover (5) is fixed in its relative position with respect to the packaging bottom (1). Furthermore, a packaged article is provided."
Disclaimer: Curated by HT Syndication.
