MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202514071660 A) filed by Triple Win Technology (SHENZHEN) Co. Ltd., Shenzhen, China, on July 28, 2025, for 'photoelectric packaging structure, manufacturing method, and camera module.'
Inventor(s) include Hsin-Yen Hsu; Tzu-Li Feng; Hung-Ta Li; and Yi-Mou Huang.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "A photoelectric packaging structure, manufacturing method, and camera module are provided. The structure includes a plastic packaging module, a photosensitive chip, and a substrate module. The plastic packaging module includes a packaging body for covering the photosensitive chip. The substrate module includes a dielectric layer and a first multilayered wiring structure having a first and a second wiring layer. The first wiring layer includes a first conductive portion and a first conductive wiring pattern. One side of the first conductive portion contacts the connection pad of the photosensitive chip. The second wiring layer includes a second conductive portion and a second conductive wiring pattern. The second conductive wiring pattern is electrically connected to another side of the first conductive portion. The first and second conductive portions constitute a first conductive channel. The photosensitive chip is electrically connected to the first and second wiring layers through the first conductive channel."
Disclaimer: Curated by HT Syndication.
