MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202514066021 A) filed by Triple Win Technology (SHENZHEN) Co. Ltd., Shenzhen, China, on July 10, 2025, for 'photoelectric packaging structure, manufacturing method thereof, and camera module.'
Inventor(s) include Hung-Ta Li; Hsin-Yen Hsu; Yi-Mou Huang; and Tzu-Li Feng.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "A photoelectric packaging structure, manufacturing method, and camera module are provided. The structure includes a substrate module, a photosensitive chip, and a cover module. The substrate module includes a packaging body and a first conductive structure. The first conductive structure includes a first and a second conductive channels, a first to a third conductive pads. The first and the second conductive channel are formed in the packaging body. The first conductive channel is connected to the first conductive pad and the second conductive pad. The photosensitive chip is located in the packaging body. The second conductive channel is connected to the non-photosensitive area and the third conductive pad. The cover module includes a cover plate body and a second conductive structure. The fourth conductive pad is connected to the second conductive pad and the third conductive pad."
Disclaimer: Curated by HT Syndication.
