MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202514002978 A) filed by Triple Win Technology (SHENZHEN) Co. Ltd., Guangdong, China, on Jan. 13, for 'photoelectric packaging structure, preparation method and camera module.'
Inventor(s) include Hsin-Yen Hsu; and Tzu-Li Feng.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "A photoelectric packaging structure, and a preparation method of the photoelectric packaging structure, and a camera module having the photoelectric packaging structure are provided. The photoelectric packaging structure includes a substrate module and a photosensitive chip. The substrate module includes a substrate, and the substrate module defines a plurality of channels. The photosensitive chip is located on the substrate, and includes a photosensitive area and a non-photosensitive area connected to the photosensitive area. Two ends of each of the channels extend to the substrate and the non-photosensitive area, respectively. A conductive layer is formed on an inner wall of each of the channels to form a hollow conductive channel. The hollow conductive channel is electrically connected to the substrate and the non-photosensitive area."
Disclaimer: Curated by HT Syndication.
