MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202514003245 A) filed by Triple Win Technology Co. Ltd., Shenzhen, China, on Jan. 14, for 'photoelectric packaging structure, preparation method and camera module.'
Inventor(s) include Hsin-Yen Hsu; and Tzu-Li Feng.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "A packaging structure, a preparation method, and a camera module are provided. The packaging structure includes a substrate module, and a light emitting unit and a light receiving unit located on the substrate of the substrate module. The substrate module defines first channels and second channels. Two ends of each first channel extend to the substrate and the non-photosensitive area of the light receiving unit, respectively. A first conductive layer is formed on an inner wall of each first channel to form a first hollow conductive channel, which is electrically connected to the substrate and the non-photosensitive area. Two ends of each second channel extend to the substrate and the light emitting unit, respectively. A second conductive layer is formed on an inner wall of each second channel to form a second hollow conductive channel, which is electrically connected to the substrate and the light emitting unit."
Disclaimer: Curated by HT Syndication.
