MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202514071661 A) filed by Triple Win Technology (SHENZHEN) Co. Ltd., Shenzhen, China, on July 28, 2025, for 'photoelectric packaging structure and camera module.'
Inventor(s) include Hsin-Yen Hsu; Tzu-Li Feng; Hung-Ta Li; and Yi-Mou Huang.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "A photoelectric packaging structure and camera module are provided. The structure includes a substrate module, a photosensitive chip, and a plastic packaging module. The substrate module includes a dielectric layer and a first multilayered wiring structure located in the dielectric layer. The first multilayered wiring structure includes a first wiring layer and a second wiring layer, the first wiring layer has a first conductive pad and a first conductive portion, the second wiring layer has a second conductive pad and a second conductive portion, the first and the second conductive portion are electrically connected to each other to form a first conductive channel. A non-photosensitive area of the photosensitive chip has a connection pad connected to the second conductive portion, such that the photosensitive chip is electrically connected to the first wiring layer through the first conductive channel. The plastic packaging module covers the photosensitive chip."
Disclaimer: Curated by HT Syndication.
