MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202517044416 A) filed by Tmeic Corporation, Tokyo, on May 7, for 'pipe arrangement connection structure.'
Inventor(s) include Hasumi Satoshi.
The application for the patent was published on May 30, under issue no. 22/2025.
According to the abstract released by the Intellectual Property India: "A pipe connection structure of an embodiment of the present invention mutually connects extending-direction ends of a first pipe and a second pipe. The first pipe and the second pipe each include a pipe body and a pair of coupling members. The pipe body has formed at an end thereof an inclined end surface which is inclined with respect to a plane orthogonal to the extending direction when viewed from a first radial direction of the pipe. The pair of coupling members are disposed on both sides in the first radial direction at the extending-direction end of the pipe, and each protrude outward in the first radial direction from an outer peripheral surface of the pipe body. In a state in which the inclined end surface of the first pipe and the inclined end surface of the second pipe are butted against each other, the pair of coupling members of the first pipe and the pair of coupling members of the second pipe are respectively fastened to each other with a fastening member."
The patent application was internationally filed on Oct. 18, 2023, under International application No.PCT/JP2023/037703.
Disclaimer: Curated by HT Syndication.
