MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517043406 A) filed by Max-Planck-Institut Fur Nachhaltige Materialien; and Gesellschaft Mit Beschrankter Haftung, Dusseldorf, Germany, on May 5, for 'process for the manufacturing of microscale hollow metal bodies.'
Inventor(s) include Ramachandramoorthy, Rajaprakash; and Kang, Sung-Gyu.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "A hollow body and a process for preparing a hollow body having a bottom, an upper end wall and side walls extending between the bottom and the upper end wall, characterized in that the upper end wall and side walls are made of metal, the cavity within the hollow body has a volume in the range between 1 picoliter to 1,000 picoliter and the upper end wall comprises at least one opening. The hollow body are suitable for encapsulating small amounts of liquid, or of very small micro-electromechanical system, may be used for the controlled release of pharmaceutical components."
The patent application was internationally filed on Oct. 17, 2023, under International application No.PCT/EP2023/078833.
Disclaimer: Curated by HT Syndication.
