MUMBAI, India, May 1 -- Intellectual Property India has published a patent application (202611027007 A) filed by Fiberise Fit Pvt. Ltd., New Delhi, on March 7, for 'protein- and fiber-enriched wheat flour composition for flatbread preparation and method for preparation thereof.'
Inventor(s) include Diwakar Vaish; and Sakshi Dhall.
The application for the patent was published on May 1, under issue no. 18/2026.
According to the abstract released by the Intellectual Property India: "The present invention discloses a protein- and fiber-enriched wheat flour composition for preparation of flatbread products such as chapatis, rotis, tortillas, and similar unleavened breads. The composition comprises whole wheat flour, yeast-derived protein, vital wheat gluten, resistant dextrin as a soluble dietary fiber, soy lecithin, guar gum, and fungal amylase enzyme in defined proportions. The incorporation of yeast-derived protein increases the overall protein content of the flour composition, while resistant dextrin enhances dietary fiber levels and water-binding capacity. Vital wheat gluten restores gluten network strength to maintain dough elasticity and puffing characteristics during flatbread preparation. Soy lecithin, guar gum, and fungal amylase act as conditioning agents that improve dough extensibility, moisture retention, and softness of the final flatbread. The invention further provides a method for preparation of the flour composition by controlled blending of macro and micro ingredients to obtain a homogeneous flour blend suitable for large-scale production and improved nutritional flatbread products."
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