MUMBAI, India, Aug. 29 -- Intellectual Property India has published a patent application (202517075083 A) filed by Vestas Wind Systems A/S, Aarhus, Denmark, on Aug. 7, for 'recycling printed circuit boards using swelling agent.'
Inventor(s) include Rehmeier, Mie; and Hansen, Jesper Romer.
The application for the patent was published on Aug. 29, under issue no. 35/2025.
According to the abstract released by the Intellectual Property India: "Methods and systems for recycling a printed circuit board (PCB). The printed circuit board is exposed to a swelling agent that causes an epoxy matrix of the printed circuit board to swell and disintegrate into particles. The particles of epoxy are then separated from the printed circuit board, leaving behind reinforcing fiber and metal containing components thereof. These remaining components are separated from each other and recycled separately using suitable processes. The epoxy particles are also recovered, and may be reduced to a monomer for use in synthesizing new epoxy. The swelling agent includes formic acid as an active ingredient."
The patent application was internationally filed on Jan. 31, 2024, under International application No.PCT/DK2024/050017.
Disclaimer: Curated by HT Syndication.
