MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202517043697 A) filed by Namics Corporation, Niigata, Japan, on May 5, for 'resin composition, adhesive, sealant, cured product, semiconductor device and electronic component.'
Inventor(s) include Meguro Kento; and Saito Atsushi.
The application for the patent was published on May 30, under issue no. 22/2025.
According to the abstract released by the Intellectual Property India: "The object of the present invention is to provide a resin composition and an adhesive that cure under a low temperature condition, provide a cured product with an excellent stress relaxation property, and have a low self-exothermic temperature during a curing reaction. The present invention provides a resin composition comprising (A) a polyfunctional epoxy compound, (B) a polyfunctional thiol compound, (C) a monofunctional compound having one group (c) containing an unsaturated double bond and an electron-withdrawing group adjacent thereto in its molecule, and (D) a curing catalyst."
The patent application was internationally filed on Dec. 22, 2022, under International application No.PCT/JP2022/047359.
Disclaimer: Curated by HT Syndication.
