MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202517044359 A) filed by Namics Corporation, Niigata, Japan, on May 7, for 'resin composition, adhesive, sealant, cured product and semiconductor device.'
Inventor(s) include Otsubo Kodai.
The application for the patent was published on May 30, under issue no. 22/2025.
According to the abstract released by the Intellectual Property India: "The object of the present invention is to provide a resin composition and an adhesive that can reduce odor derived from thiol curing agents and provide a cured product with reduced odor. The present invention provides a resin composition comprising (A) a thiol curing agent having two or more thiol groups, (B) a main agent having two or more groups (b) each of which is reactive with a thiol group, (C) an odor masking agent having one group (c) reactive with a thiol group, and (D) a heat latent curing catalyst, wherein the amount of the (A) thiol curing agent is 10 to 60% by weight of the total weight of the resin composition, and the component (C) is a monofunctional compound having one group containing an unsaturated double bond and an electron-withdrawing group adjacent thereto in its molecule."
The patent application was internationally filed on Dec. 22, 2022, under International application No.PCT/JP2022/047360.
Disclaimer: Curated by HT Syndication.
