MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202517066477 A) filed by Advanced Micro Devices, Inc., Santa Clara, U.S.A., on July 11, for 'reusable templates for semiconductor design and fabrication.'

Inventor(s) include Loh, Gabriel H.; Basso, Todd David; Tu, Steven; Hort, Joshua A.; Leong, Chia-Ken; Beker, Benjamin; and Kashem, Anwar P.

The application for the patent was published on July 25, under issue no. 30/2025.

According to the abstract released by the Intellectual Property India: "A substrate includes a location for coupling one or more chiplets to the substrate. The location has dimensions that bound dimensions of chiplets capable of being coupled to the substrate in the location. Additionally, the location includes an interface region having connections for one or more die-to-die interfaces of the one or more chiplets and a power region that includes a power interface having connections for the one or more chiplets."

The patent application was internationally filed on Dec. 13, 2023, under International application No.PCT/US2023/083929.

Disclaimer: Curated by HT Syndication.