MUMBAI, India, March 13 -- Intellectual Property India has published a patent application (202621006310 A) filed by Dr. Rohini Kharwade; Dr. Alok Ramkesh Rai; Mr. Kunal Liladhar Palandurkar; Ms. Dimple Milind Wankhede; Ms. Antara Amit Patil; Mr. Ayush Patre; and Mr. Rohan Rajendra Mate, Nagpur, Maharashtra, on Jan. 22, for 'rhein-encapsulated silver nanoparticles incorporated into nanofiber scaffolds for enhanced wound healing applications.'
Inventor(s) include Dr. Rohini Kharwade; Dr. Alok Ramkesh Rai; Mr. Kunal Liladhar Palandurkar; Ms. Dimple Milind Wankhede; Ms. Antara Amit Patil; Mr. Ayush Patre; and Mr. Rohan Rajendra Mate.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "The present invention demonstrates the development rhein-loaded silver nanoparticles (R-AgNPs) incorporated into of a bioactive poly (lactic-co-glycolic acid) - collagen electrospun nanofiber scaffold as an effective therapeutic system 10 for diabetic wound healing. Rhein has been efficiently encapsulated within silver nanoparticles, resulting in improved solubility, stability, and sustained release, while minimizing the direct cytotoxic exposure of silver at the wound site. The uniform incorporation of R-AgNPs into the nanofiber matrix produces smooth, continuous scaffolds that closely mimic the extracellular matrix, thereby supporting 15 cell adhesion and tissue regeneration."
Disclaimer: Curated by HT Syndication.
