MUMBAI, India, Aug. 29 -- Intellectual Property India has published a patent application (202517074942 A) filed by Arcelormittal, Luxembourg, on Aug. 6, for 'sandwich panel and building envelope thereof.'
Inventor(s) include Begue, Olivier; Vignal, Renaud; and Descazeaux, Mederic.
The application for the patent was published on Aug. 29, under issue no. 35/2025.
According to the abstract released by the Intellectual Property India: "The invention relates to a sandwich panel (19 comprising a photovoltaic active area (24) positioned on the outer sheet (4) and whose upper, respectively lower, electrical connector is positioned in an upper, respectively lower, cavity (44, 45), the upper cavity being positioned within the insulation material (2) in the upper half of the sandwich panel and adjacent to either the second longitudinal side of the insulation material or the inner sheet so that the upper electrical connector can be accessed from the upper cavity, the lower cavity being positioned within the insulation material in the lower half of the sandwich panel and adjacent to either the second longitudinal side of the insulation material or the inner sheet so that the first lower electrical connector can be accessed from the lower cavity."
The patent application was internationally filed on Dec. 12, 2023, under International application No.PCT/IB2023/062534.
Disclaimer: Curated by HT Syndication.
