MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202527064913 A) filed by Tcl Zhonghuan Renewable Energy Technology Co. Ltd., Tianjin, China, on July 8, for 'silicon powder forming method, silicon block and use.'
Inventor(s) include Wang, Lin; Fan, Guoqing; Yang, Zhi; Wu, Haoyang; Xiang, Long; and Li, Lei.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "A silicon powder forming method, comprising the following steps: placing a mold (1) filled with a silicon powder under the condition of a first pressure P1 for a first pressure time T1, so as to obtain a silicon block, wherein 50MPa=P1=600MPa, and 7min=T1=15min; the medium that applies the first pressure is a liquid. The present invention further relates to a silicon block and a use. By controlling the pressure, the formed silicon block is easily removed from the mold (1) without being crushed or raising dust, and is also easily crushed during filling, the particle size distribution after crushing being easily controlled. The formed silicon block can be directly applied to Czochralski crystal production, and the packing density is increased to 0.18 g/cm3-0.25 g/cm3."
The patent application was internationally filed on Sept. 04, 2023, under International application No.PCT/CN2023/116744.
Disclaimer: Curated by HT Syndication.
