MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202411018810 A) filed by Teerthanker Mahaveer University, Moradabad, Uttar Pradesh, on March 14, 2024, for 'soldering assistive device.'
Inventor(s) include Mayur Agarwal.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "A soldering assistive device, comprises a cylindrical shaped body 1 configured with a telescopic handle 2 for providing grip to the user, a laser sensor mapped on the body 1 for detecting size of the user's hands, an ultrasonic sensor mapped on the body 1 for detecting distance, an electromagnetic switch integrated within the body 1 for enabling power supply, an artificial intelligence-based imaging unit 3 to generate a 3D map of the circuit, a user interface installed inside a computing unit which is associated with the device for user input, a projection unit 4 assembled on the body 1 for projecting a holographic image, an optical sensor mapped on the body 1 for detecting movements of the user's hand, and a pair of curve shaped telescopic plate 5 attached with the body 1 for extending to cover the rod 6."
Disclaimer: Curated by HT Syndication.
