MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517059055 A) filed by Alpha Assembly Solutions Inc., Waterbury, U.S.A., on June 19, for 'soldering method, solder paste, solder flux and solder joint.'
Inventor(s) include Shrivastava, Saurabh; Das, Ansuman; Patra, Mamata, Rami; Pai, Laxminarayana; Plant, Alan; Sarkar, Siuli; Choudhury, Pritha; Ribas, Morgana; Kumar, Anil; and Rangaraju, Raghu, R.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "A soldering method comprising: providing a solder paste between two or more work pieces to be joined, the solder paste comprising solder particles dispersed in a paste flux; and subjecting the solder paste to a temperature profile to reflow the solder particles and form a solder joint between the two or more work pieces, wherein, when the paste flux is subjected to thermogravimetric analysis according to ASTM E1131-20, weight loss occurring in the range of from the solidus temperature of the solder to the highest temperature in the temperature profile is no more than 25%."
The patent application was internationally filed on Dec. 15, 2023, under International application No.PCT/EP2023/025528.
Disclaimer: Curated by HT Syndication.
