MUMBAI, India, March 7 -- Intellectual Property India has published a patent application (202327033843 A) filed by Lvfen Environmental Protection Tech Co. Ltd., Beijing, on May 14, 2023, for 'strong magnet particle accelerated material cleaning method and application thereof.'

Inventor(s) include Liu, Tianbo; and Peng, Huaiming.

The application for the patent was published on March 7, under issue no. 10/2025.

According to the abstract released by the Intellectual Property India: "The present invention relates to a strong magnet particle accelerated material cleaning method and an application thereof, and aims to remove harmful particles, dust, fluff, ribbons, bacteria, viruses and other impurities from non-metal materials, to improve the quality of particle materials. The materials enter from a material inlet and are accelerated by cooperating wind flow and an accelerator plate, such that material particles move at a certain speed, and the position point and the speed when the materials reach the highest speed are controllable; and an internal high-intensity magnetic field unit is provided at the position where the materials pass through, particularly, the internal high-intensity magnetic field unit is provided at the position point when the materials reach the highest speed, and an internal high-intensity magnetic field is generated by means of the internal high-intensity magnetic field unit. According to the present invention, the attraction such as the electromagnetic force, Van der Waals force and liquid bridge force between the materials and impurities attached to the surfaces of the materials is eliminated by using the internal high-intensity magnetic field, and the internal high-intensity magnetic field can be matched with the wind flow to weaken the attraction such as the Van der Waals force and the liquid bridge force between the material particles and the impurities attached to the material particles by means of friction and collision with internal parts, such that the cleanliness of the materials is improved."

The patent application was internationally filed on Nov. 17, 2021, under International application No.PCT/CN2021/131093.

Disclaimer: Curated by HT Syndication.