MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202527079071 A) filed by Honor Device Co. Ltd., Guangdong, China, on Aug. 20, for 'structural part, preparation method for structural part and electronic device.'
Inventor(s) include Zhang, Hongming; Wang, Xiaoguang; Huo, Guoliang; Zhou, Qichen; Feng, Yu; and Zang, Yongqiang.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "Provided in the present application are a structural part, a preparation method for the structural part and an electronic device. The structural part comprises a base material and a metal coating layer, wherein the base material comprises an outer surface, and the metal coating layer is arranged on the outer surface. The base material is prepared from a polymer material having a polar group; the thermal deformation temperature of the polymer material is greater than or equal to 175 C; and the thermal expansion coefficient of the polymer material is less than or equal to 60*10-6/K. In the structural part shown in the present application, the base material is prepared from the polymer material having a polar group, and the polar group of the polymer material is beneficial for forming a strong binding force with the metal coating layer; and the metal coating layer can be directly formed on the outer surface of the base material, and does not need to design a priming coat located between the metal coating layer and the outer surface, thereby simplifying the preparation process of the structural part, and improving the production efficiency of the structural part."
The patent application was internationally filed on Mar. 12, 2024, under International application No.PCT/CN2024/081143.
Disclaimer: Curated by HT Syndication.
