MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202517022442 A) filed by John Bean Technologies Corporation, Chicago, on March 12, for 'sub-primal cut identification and packaging optimization system and method.'
Inventor(s) include Blaine, George R; and Stockard, Richard D.
The application for the patent was published on May 30, under issue no. 22/2025.
According to the abstract released by the Intellectual Property India: "A method carried out by a computing device may include: receiving a plurality of models each associated with a type of sub-primal cut, including a reference shape(s) for detection of a corresponding match characteristic by a corresponding scan type, and including a plurality of attribute characteristic value ranges; receiving a registered scan of a sub-primal cut including scans showing corresponding match characteristics; identifying attribute characteristics for the sub-primal cut using the registered scan; concurrently aligning reference shape(s) of each model to corresponding match characteristics and calculating a shape match values based on the alignment; determining a best model match for the registered scan using a plurality of attribute match values calculate based on the identified attribute characteristics compared to the attribute characteristic value ranges and the plurality of shape match values; and assigning a type of sub-primal cut to the sub-primal cut based on the best model match."
The patent application was internationally filed on Sept. 07, 2023, under International application No.PCT/US2023/073640.
Disclaimer: Curated by HT Syndication.
