MUMBAI, India, March 13 -- Intellectual Property India has published a patent application (202621025664 A) filed by Kunaal Gadhalay, Aurangabad, Maharashtra, on March 4, for 'sustainable high-density mobile memory chip employing tin vias, biopolymer substrate, and hybrid die stacking.'
Inventor(s) include Kunaal Gadhalay.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "The invention discloses a mobile memory chip architecture employing tin-based vertical interconnects and a biodegradable biopolymer substrate reinforced with Si-TaN nanocrystals. The chip comprises a multi-layered structure with a bottom computing logic layer, intermediate memory access controllers, and a top data storage layer formed by stacked dies of ReRAM, MRAM, and LPDDR5, fabricated at 3 nm scale and arranged in modular configurations of 5-10 layers with 32-128 packages per page. Vertical connectivity is achieved through back-end-of-line tin vias and through-silicon tin vias, enabling high-density integration and reduced resistance compared to conventional copper interconnects. Thermal management is provided by a composite paste of carbon particles, tin micro/nano particles, and tin oxide, which enhances conductivity, mitigates oxidation, and supports recyclability. The architecture incorporates rounded R5 mm corner radii and tin-reinforced connection pins for mechanical robustness and eco-compatibility. This invention addresses limitations of conventional memory packaging by combining sustainability, modular scalability, and heterogeneous die stacking, thereby enabling high-performance mobile devices with reduced environmental impact."
Disclaimer: Curated by HT Syndication.
