MUMBAI, India, March 13 -- Intellectual Property India has published a patent application (202611009695 A) filed by Delhi Technological University, New Delhi, on Jan. 30, for 'system and method for fabricating dissimilar alloy structure using cmt-waam.'
Inventor(s) include Meena, Rajendra Prasad; Yuvaraj, Narayan; Vipin; Arora, Bharat Bhushan; and Arora, Akhilesh.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "The disclosed system (100) for fabricating a dissimilar alloy structure using Cold Metal Transfer-based Wire Arc Additive Manufacturing (CMT-WAAM), includes a material deposition unit (102) configured to deposit metal layers onto a substrate (S) using first and second filler wires, respectively. The system (100) includes a table unit (104) configured to hold and move the substrate (S) relative to the material deposition unit (102). The system (100) includes an ultrasonic vibration assembly (108) being operable to apply ultrasonic vibrations at a pre-defined frequency and a pre-defined amplitude to the deposited metal layers during a deposition process to improve grain structure and mechanical properties of the deposited material."
Disclaimer: Curated by HT Syndication.
