MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202517067077 A) filed by Patil, Prashant, Cambridge, U.S.A., on July 14, for 'systems and methods for manufacturing printed circuit boards.'
Inventor(s) include Patil, Prashant.
The application for the patent was published on Nov. 14, under issue no. 46/2025.
According to the abstract released by the Intellectual Property India: "Systems and methods for overcoming technical problems associated with machining and manufacturing printed circuit boards. In some embodiments, the systems and methods include a process to remove or reduce defects in initially created printed circuit board (PCB) traces. For example, a method can include a process to remove or reduce burrs of laser micromachined PCB traces (which can be electrically isolated from each other). In some cases, a material is deposited over the PCB traces, and the depositing results in a conducting layer that electrically connects all or most of the PCB traces and provides an electrical connection for removing or reducing the defects in the PCB traces."
The patent application was internationally filed on Jan. 04, 2024, under International application No.PCT/US2024/010265.
Disclaimer: Curated by HT Syndication.
