MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202537063334 A) filed by Institut Dr. Foerster Gmbh & Co. Kg, Reutlingen, Germany, on July 3, for 'test method and test apparatus for testing the leakage flux of cables.'
Inventor(s) include Eibofner, Frank; and Hecker, Friedrich.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "The invention relates to a test method for testing the leakage flux of a cable in order to detect defects, wherein a test apparatus (100) and the cable (200) are moved relative to one another in the longitudinal direction of the cable. In the method, portions of the cable are successively magnetised by means of a magnetising device (120) of the test apparatus such that magnetisation field lines in the cable are oriented substantially in the longitudinal direction of the cable. The circumference of the magnetised portion of the cable is scanned by means of sensors (140) of a sensor array (130) which are sensitive to magnetic fields, in order to sense stray magnetic fields caused by defects. This sensor array has a plurality of sensors (140) which are sensitive to magnetic fields and are arranged offset from one another in the circumferential direction and at a test distance (142) from the surface of the test object during the test. Electrical sensor signals from the sensors are evaluated to assess the defects. Each sensor of the sensor array is arranged in a movably mounted test shoe (150), which has a sliding face (146) for sliding on the circumferential face of the cable, wherein the sensor (140) is set back from the sliding face by a sensor distance (145). In a first test configuration, the test shoe (150) is pressed against the circumferential face such that the sliding face (146) is in contact with the circumferential face, and the sensor is kept at a finite first test distance, which corresponds substantially to the sensor distance, from the surface of the test object."
The patent application was internationally filed on Nov. 23, 2023, under International application No.PCT/EP2023/082864.
Disclaimer: Curated by HT Syndication.
