MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517072380 A) filed by Sekisui Chemical Co. Ltd., Osaka, Japan, on July 30, for 'thermally conductive resin composition and thermally conductive member.'
Inventor(s) include Kobayashi, Yuusuke; Furukawa, Atsushi; Iwamoto, Tatsuya; and Yoshioka, Tetsurou.
The application for the patent was published on Aug. 22, under issue no. 34/2025.
According to the abstract released by the Intellectual Property India: "A thermally conductive resin composition comprising: an epoxy resin; an amine curing agent having three or more active hydrogen atoms in amino groups; and a thermally conductive filler, wherein the equivalent ratio of the active hydrogen atoms in the amino groups to the epoxy groups is greater than 1 but less than 2.7."
The patent application was internationally filed on Jan. 31, 2024, under International application No.PCT/JP2024/003187.
Disclaimer: Curated by HT Syndication.
